208-7391-55-1902
CONN SOCKET SOIC 8POS GOLD
208-7391-55-1902 Specifications
Mounting Type：
Through Hole
Part Status：
Active
Contact Finish - Mating：
Gold
Contact Finish Thickness - Mating：
30.0µin (0.76µm)
Contact Resistance：
-
Material Flammability Rating：
UL94 V-0
Termination：
Solder
Contact Material - Mating：
Beryllium Copper
Contact Finish - Post：
Gold
Features：
Closed Frame
Number of Positions or Pins (Grid)：
8 (2 x 4)
Current Rating (Amps)：
1 A
Pitch - Post：
-
Contact Material - Post：
Beryllium Copper
Pitch - Mating：
-
Operating Temperature：
-55°C ~ 150°C
Contact Finish Thickness - Post：
30.0µin (0.76µm)
Termination Post Length：
0.140" (3.56mm)
Housing Material：
Polyethersulfone (PES), Glass Filled
Type：
SOIC
